Introduction

IP/chip/package codesign(1->2->N) : 1/3 NRE$, 1/3 cycletime, x3 flexibility.

Professional design specialty

Others�?半導體

Be expert in product design specialty

Electronic products

Product Designs Executed Before

ITRI & MIRDC: miniFab consulting.
SiP /3DIC supplychain:EDA/IP+/PDK+/CPI design service.
IoT applications:
1. Power-IC: AIoT-Connector
2. Analog-IC:Camera OIS-driver, E-ink display driver.

Awards/Achievements

3 patents ongoing (power-grid management...; AIoT-connector...; Active interposer...)


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