Introduction
IP/chip/package codesign(1->2->N) : 1/3 NRE$, 1/3 cycletime, x3 flexibility.
Professional design specialty
其他：半導體
Be expert in product design specialty
電子產品
Product Designs Executed Before
ITRI & MIRDC: miniFab consulting.
SiP /3DIC supplychain：EDA/IP+/PDK+/CPI design service.
IoT applications：
1. Power-IC: AIoT-Connector
2. Analog-IC：Camera OIS-driver, E-ink display driver.
SiP /3DIC supplychain：EDA/IP+/PDK+/CPI design service.
IoT applications：
1. Power-IC: AIoT-Connector
2. Analog-IC：Camera OIS-driver, E-ink display driver.
Awards/Achievements
3 patents ongoing (power-grid management...; AIoT-connector...; Active interposer...)